Raytheon Technologies Principal Development Integrated Product Team (IPT) Lead in Huntsville, Alabama
The Electrical Product Team - Subsystems Center is looking for an electrical subsystem Development Integrated Product Team (IPT) Lead. The IPT Lead engineer is responsible for driving the execution of the electrical subsystem through the development of the product. Tasks include leading proposal activities, supporting development activities, and technical management of both engineering disciplines and suppliers.
Successful candidate will be a self-starter with proven project organization and execution skills, multi-tasking and verbal/written communication and presentation skills, and experience in a budget and schedule critical environment. Candidates should lead multi-discipline teams to develop systems from concept through integration and production, and develop solutions to a variety of technical problems of large scope and complexity. A candidate willing to collaborate and coordinate with Operations, Supply Chain, Quality, and other Engineering disciplines to resolve issues.
U.S. Citizenship status is required as this position needs an active U.S. Security Clearance as of day one of employment.
Location: Huntsville, AL.
Some travel to suppliers may be required.
Minimum of 8 years of engineering experience with progressing leadership roles
Knowledge of RF, analog, or digital circuit design, analysis, integration and/or test
Experience with Earned Value Management methodologies
U.S Citizenship is required
Experience in the design, test and sell off of military systems.
Demonstrated ability to work with a complex engineering team
Solid understanding of hardware testing methodologies
Experience in Root-Cause Corrective Action investigations and FRACAS processes
Knowledge and experience with Material Review Board, Process Configuration Board, Configuration Control Board and Failure Review Board processes, proposing/defending and implementing Change Notices
Proposal development and bidding activities
Experience managing DoD contracts with Customer and Cross Functional Engagements
Knowledge of printed circuit board fabrication and circuit card assembly processes and related industry specifications
Familiarity with missile communication transceivers and data links, IR or RF sensors, inertial measurement units (IMU) and Global Positioning System (GPS) receiver subsystems
Ability to travel within the US
Planning and leading hardware subsystem development activities
Technical writing and/or formal presentation experience
Bachelor’s Degree (BS) in Electrical Engineering, Mechanical Engineering, Systems Engineering, Physics, Math or related STEM degree
This position requires the successful issuance, transfer or maintenance of any clearances and/or accesses necessary for the position.
Non-US citizens may not be eligible to obtain a security clearance.
The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process.
Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement.
Additional detail regarding security clearance factors can be obtained by accessing the DISCO website
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, age, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.